Pyraluxг Flexible Circuit Materials

Pyralux flexible circuit materials pyralux flexible circuit materials dupont offers a comprehensive industry leading portfolio of pyralux flexible circuit materials and systems designed to meet today s and next generation design challenges.

Pyraluxг flexible circuit materials.

Material selection is determined by the combination of the electrical mechanical bend requirements and cost considerations of a specific design. Available with ra dt ra and ed coppers. 17 35 and 70um. Dupont s expertise in polymer chemistry has made its line of pyralux laminates the industry leader in flexible circuit materials for over 30 years.

Dupont pyralux tk is a fluoropolymer polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications. Pyralux lf flexible circuit materials excellent automotive fluids reliability. Dupont pyralux lf b is dupont kapton b black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired. Adhesiveless adhesiveless materials manufactured as either cast dielectric on copper or sputtered copper on dielectric film.

Product manager adhesiveless products 4 03 evaluation testing thermal cycling peel strength performance thermal cycling has been established as one of the standard accelerated aging test methods to assess functional reliability throughout the industry. Copper can be an ideal material when deposited in a manner that is compatible with the flexible circuit manufacturing process which is often done on roll to roll equipment. Today pyralux boasts a diverse portfolio designed to meet the various flexible circuit needs of consumers in the telecommunications defense automotive aerospace and medical industries. Dupont launches pyralux ag flexible circuit materials.

A wide variety of materials and configurations are available to address the needs of today s design applications. Flex circuit substrate materials fall into 2 general categories adhesiveless and adhesive based. Construction and certification for laminate. Flexible circuits pose unique challenges for metallization.

Selecting the optimum flex circuit board material is a key element to the success of a flexible circuit design. Pyralux tk copper clad laminate and bonding film system. The coverlay is made with the leading dupont kapton brand black polyimide film for high performance applications where matte black material enhances design aesthetics. The tight bending radii present in many design configurations require flexible metal layers with high electrical conductivity.

12 25 50 75 and 125um. It is ideal for use in rigid flex and multilayer flex applications which require advanced performance such as low dissipation loss for high speed high frequency thermal resistance and high reliability. These materials have gained popularity for several reasons.